ALPHA?OM-338-T 是一款無鉛免清洗錫膏，設計用于多種應用。ALPHA OM-338-T 較寬的加工窗口設計用于最大程度減少從錫/鉛到無鉛錫膏的過渡問題。這種材料被設計為具有與錫鉛工藝相媲美的性能。*ALPHA OM-338-T 在多種電路板設計上都能產生出色的印刷能力性能，尤其是在具有超精細特征重復性（11 平方密爾）和高吞吐量的應用中。
出色的回流工藝窗口提供了良好的 CuOSP 焊接性，能夠出色地熔融愈合多種沉積尺寸，具有出色的抗隨機錫珠形成性以及片式元件間錫珠性能。ALPHA OM-338-T 采用的配方可產生出色的焊點外觀。此外，ALPHA OM-338-T 的 IPC III 類空洞和 ROL0 IPC 分類能力確保了最大程度提高長期產品可靠性。ALPHA OM-338-T 也被稱為具有 M13 粘度的 ALPHA OM-338。
特點和優勢
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness.
- Excellent print consistency with high process capability index across all board designs.
- Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput.
- Wide reflow profile window with good solderability on various board / component finishes.
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- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III.
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
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