ALPHA?OM-340 是一款無(wú)鉛免清洗錫膏，設(shè)計(jì)用于多種應(yīng)用。ALPHA OM-340 具有同類(lèi)產(chǎn)品中最低的球窩缺陷率，并且在電路內(nèi)測(cè)試/引腳測(cè)試中實(shí)現(xiàn)了出色的首次通過(guò)良率。ALPHA OM-340 在多種電路板設(shè)計(jì)上也能產(chǎn)生出色的印刷能力性能，尤其是在具有超精細(xì)特征重復(fù)性和高“吞吐量”的應(yīng)用中。
出色的回流工藝窗口提供了出色的 CuOSP 焊接性，能夠出色地熔融愈合多種沉積尺寸，具有出色的抗隨機(jī)錫珠形成性以及片式元件間錫珠性能。ALPHA OM-340 采用的配方可產(chǎn)生出色的焊點(diǎn)外觀，以及同類(lèi)產(chǎn)品中最高的電路內(nèi)引腳測(cè)試良率。此外，ALPHA OM-340 的 IPC III 類(lèi)空洞和 ROL0 IPC 分類(lèi)能力確保了最大程度提高長(zhǎng)期產(chǎn)品可靠性。
特點(diǎn)和優(yōu)勢(shì)
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
- Excellent print consistency with high process capability index across all board designs
- Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Best in class low defect rate for Head in Pillow
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- Best in class in circuit pin test yield
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
- Zero halogen (No halogen intentionally added to the formulation)
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